Silicon Valley based SENSOR FOUNDRY

Build your own breakthrough innovations at STNF

STNF AT A GLANCE

From wafer fabrication to packaging and multi-fab integration — all through one engineering partner.

Patterned wafers

Wafer Fabrication

Custom wafer processes for sensors, MEMS and specialty semiconductors.

CMOSMEMS
Custom Process
Semiconductor device held for inspection

Advanced Packaging

Wire bonding, chip bonding and device integration.

Chip-to-PCB
Interconnection
PCB with integrated circuit

PCB Integration

From bare die to functional prototype.

Integration
Prototype
Chip bonding interconnects

Multi-Fab Execution

The right process. The right facility. One STNF interface.

Chip Assembly
Device Integration

FABRICATION CAPABILITIES & PROCESS ENGINEERING

CHOSEN BY INNOVATORS WORLDWIDE

Axiome BioscienceCarbide RadioMicrosoftAcorn TechnologiesInchFabSundiodeRiverside ResearchAnalog DevicesNanosysCeremorphicBreakwater
OusterPavilion Integration CorporationSan Francisco State UniversityLawrence Livermore National LaboratoryOA InnovationsParadromicsTexas A&M UniversityDigiLensNodexusMarel Power Solutions

MULTI-FAB PROCESS NETWORK

Connecting the right facilities across the U.S. and Korea for every process step.

GOT AN IDEA? LET’S MAKE IT REAL

From wafer process to working device, STNF helps bring your semiconductor innovation to life.

Talk to our engineers