Stratio, Inc.

SNF CONSULTING

Service Provided

STRATIO, INC., the provider of STNF services, is an independent consultant of Stanford Nanofabrication facility (SNF).

Contact Us
The idea for STRATIO was born in the corridors of the Stanford Nanofabrication Facility (SNF) while our founders were actively researching and developing infrared technologies within the fab. The connection between our company and the SNF is a story of great collaboration and success, starting with the incorporation of our company and has continued through the issuance of breakthrough patents.
Our team of experts are trained in the use of all equipment available at the Stanford Nanofabrication Facility.
Their expertise covers readout integrated circuit (ROIC) design/implementation for CMOS and MEMS based devices and various wafer processing techniques, including various film deposition, CMP, wafer bonding & layer transfer; as well as low volume wire bonding services and custom PCB design/implementation.
Below is a non-exhaustive list of machines our team can help you with:

ETCHERS

Primary materials etched are indicated for each equipment

Etchers types:

Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE), Plasma Mode Etching (PLASMA), Asher (ASHER), Vapor Etching (VAPOR)

  • Oxford III-V ICP

    Gallium Arsenide (GaAs)

  • Plasma Therm Versaline LL ICP Metal Etcher ICP

    Various metals

  • Plasma Therm Versaline LL ICP Dielectric Etcher ICP

    Various metals

  • STS Deep RIE Etcher ICP

    Silicon (Si)

  • Lam Research TCP 9400 Poly Etcher ICP

    Silicon (Si), Poly Silicon (Si)

  • AMT Oxide Plasma Etcher RIE

    Photoresist, Silicon (Si), Silicon dioxide (SiO2), Silicon Nitride (SiN)

  • MRC Reactive Ion Etcher RIE

    Various dielectrics, Various metals

  • Oxford Dielectric Etcher RIE

    PI (Polyimide), Silicon Carbide (SiC), Silicon dioxide (SiO2), Silicon Nitride (SiN)

  • Drytek 100 Plasma Etcher PLASMA

    Photoresist, Poly Silicon (Si), Silicon (Si), Silicon Nitride (SiN)

  • Samco PC300 Plasma Etch System PLASMA

    Photoresist

  • Gasonics Aura Asher ASHER

    Photoresist

  • Matrix Plasma Resist Strip ASHER

    Photoresist

  • Xactix Xenon Difluoride Etcher VAPOR

    Germanium (Ge), Silicon (Si), Silicon Germanium (SiGe)

  • SPTS uetch vapor etch VAPOR

    Silicon dioxide (SiO2)

  • AMAT P5000 Etcher RIE

    Poly Silicon (Si), Si based materials (Si based materials), Silicon (Si), Silicon dioxide (SiO2), Silicon Germanium (SiGe), Silicon Nitride (SiN), Silicon Oxynitride (SiON)

  • Technics Asher ASHER

    Photoresist

FURNACES

Accepted materials are indicated for each equipment

Furnaces types:

Oxide Growth (THERMAL), Forming Gas Annealing (FGA), Rapid Thermal Annealing (RTA)

  • Thermco1,2 and 3 THERMAL

    Dry & Wet oxidation, Nitrogen anneal

  • Tylanfga FGA

    10% H2 in N2, N2

  • Aw610_r and Aw610_l RTA

    4% H2 in N2, N2, Ar, O2, NH3

CVD TOOLS

Accepted materials are indicated for each equipment

CVD types:

Plasma Enhanced ALD (PE-ALD), Thermal ALD (T-ALD), Low-Pressure CVD (LPCVD), Plasma-Enhanced CVD (PECVD)

  • Fiji 1 PE-ALD

    Diele Alumina (Al2O3), Dielectrics (Various), Hafnia (HfO2), Hafnium Nitride (HfN), Metal oxides (Metal oxides), Platinum (Pt), Ruthenium (Ru), Silicon dioxide (SiO2), TaN (TaN), Tantalum Pentoxide (Ta2O5), Titania (TiO2), Ti Nitride (TiN), Zirconia (ZrO2)

  • Fiji 2 PE-ALD

    Alumina (Al2O3), Dielectrics (Various), Gallium Oxide (Ga2O3), Hafnia (HfO2), Hafnium Nitride (HfN), Indium Oxide (In2O3), ITO (InxSnyOz), Metal oxides (Metal oxides), Molybdenum Oxide (MoO3), Nickel Oxide (NixOy), Platinum (Pt), Ruthenium (Ru), Silicon dioxide (SiO2), Silicon Nitride (SiN), Strontium Oxide (SrO) Tantalum Pentoxide (Ta2O5), Tin Oxide (SnO2), Titania (TiO2), Ti Nitride (TiN), Zirconia (ZrO2)

  • Fiji 3 PE-ALD

    Alumina (Al2O3), Dielectrics (Various), Hafnia (HfO2), Silicon dioxide (SiO2), Titania (TiO2)

  • Savannah T-ALD

    AZO (AlxZnyOx), Alumina (Al2O3), Dielectrics (Various), Gallium Oxide (Ga2O3), Hafnia (HfO2), Metal oxides (Metal oxides), Tin Oxide (SnO2), Titania (TiO2), Zinc Oxide (ZnO3), Zirconia (ZrO2)

  • Epi2 Epi

    Germanium (Ge), Poly Silicon (Si), Silicon (Si), Silicon Germanium (SiGe)

  • ThermcoPoly1 and 2 LPCVD

    Germanium (Ge), Poly Silicon (Si), Silicon (Si), Silicon Germanium (SiGe)

  • STS Plasma Enhanced CVD PECVD

    Silicon dioxide (SiO2), Silicon Nitride (SiN)

  • PlasmaTherm Shuttlelock PECVD System PECVD

    Silicon dioxide (SiO2), Silicon Nitride (SiN)

  • PlasmaTherm Versaline HDP CVD System PECVD

    Silicon dioxide (SiO2), Silicon Nitride (SiN)

  • The rmcoLTO LPCVD

    Silicon dioxide (SiO2)

  • TylanBPSG LPCVD

    Silicon dioxide (SiO2)

  • ThermcoNitride LPCVD

    Silicon Nitride (SiN)

For all additional details regarding the equipment available at the SNF, please refer to the official website.