CMP

Remove unwanted conductive or dielectric materials on the
wafer(s) by utilizing a chemical slurry formulation and mechanical
polishing process.

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Procedure

Customer specifies their requirements through the form provided

Customer receives an estimated quote from STNF

Customer sends their 4” wafers(s) to STNF*

STNF performs the specified service

STNF sends an invoice to the customer

Wafer: 4” Standard only
Accepted materials: Silicon, Germanium, Oxide, Nitride
Unaccepted materials: III-V, any Metal and Metal Oxide
Unlisted materials: Please contact STNF directly to discuss the use of unlisted materials.