Stratio, Inc.

WIRE BONDING

Equipment: WestBond 7476E-79

Service Provided

Create electrical interconnections between semiconductors and silicon chips using bonding wires.
▸We offer Gold (Au) and Aluminium (Al) wires.

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Procedure
* Shipping Address : 2211 Fortune Drive, Suite A, San Jose, CA 95131

Conditions

  • Pad size: 50x50 μm or larger
    Pitch size: 200 μm or larger
  • * For any other size, please contact STNF for discussion